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Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang ...

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

"N2 wafers take ~14 weeks to be fabricated across ... the Apple iPhone 15 Pro went on sale in September 2023 with N3 silicon and TSMC has since introduced two further derivations of its 3nm ...

Boldly going Nvidia and TSMC have developed a silicon photonics-based chip prototype, according to a recent report from the ...

TSMC's Fab 21 in Arizona is gradually ramping up production, and recently it began to manufacture some of AMD's Ryzen ...

GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its ...

Tim Culpan, a well-connected industry insider, has revealed that Fab 21 is already producing at least three major chip ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Q2 2025 Earnings Call Transcript January 13, 2025 Operator: Greetings. Welcome to the Aehr Test Systems Fiscal 2025 Second ...