AI Chips Today - Alchip Technologies Leads with Advanced 3DIC Design Services
Alchip Technologies has unveiled its advanced 3DIC design services tailored for AI and high-performance computing (HPC) ...
Alchip Opens 3DIC ASIC Design Services
Proven AI and HPC ASIC Design Flow Production-ready 3DIC cross-section Alchip’s newly available 3DIC design flow addresses ...
Synopsys, Inc. (SNPS): Driving AI Innovation with Advanced Chip Design and 3D-IC Technologies
We recently compiled a list of the 20 Best Artificial Intelligence (AI) Stocks to Buy According to Analysts. In this article, ...
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3DIC and packaging drive AI chip innovation at SEMICON Japan 2024
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.
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Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs
Multi-die integration —in which many chip dies are stacked and integrated in a single package ... technologies into solutions addressing different market segments or needs. 3DIC Compiler is a complete ...
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Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC ...