Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

Nvidia ( NASDAQ:NVDA) is making a major shift in its AI chip packaging strategy, transitioning from CoWoS-S to CoWoS-L as it ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Krish Sankar, an analyst from TD Cowen, maintained the Hold rating on TSMC (TSM – Research Report). The associated price target was raised to ...

It is not hard to figure out who is in the catbird seat in the semiconductor foundry business. In 2024, according to CC Wei, ...

The opening ceremony for the Tan-Ke factory in the central city of Taichung was attended by Jensen Huang, CEO and co-founder ...

Shares of semiconductor equipment manufacturers, including ASML (AS:ASML), Lam Research (NASDAQ:LRCX), Applied Materials (NASDAQ:AMAT), and KLA Corp, experienced significant gains on Thursday. The ...

As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

Nvidia CEO shortens visit due to crowding, also visited Siliconware Precision Industries | Jan. 17, 2025 18:31 ...

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims ...