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Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its ...

"N2 wafers take ~14 weeks to be fabricated across ... the Apple iPhone 15 Pro went on sale in September 2023 with N3 silicon and TSMC has since introduced two further derivations of its 3nm ...

Nvidia Corp’s demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) remains strong though the kind of technology it needs is changing, Nvidia CEO Jensen Huang (黃仁勳) said ...

Good afternoon, everyone, and welcome to TSMC’s Fourth Quarter 2024 Earnings Conference and Conference Call. This is Jeff Su, ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Q2 2025 Earnings Call Transcript January 13, 2025 Operator: Greetings. Welcome to the Aehr Test Systems Fiscal 2025 Second ...

TSMC has achieved an enormous 90 billion US dollars in sales in 2024 – and is also earning splendidly again. 3 nm production ...

TSMC is on a roll as it just reported fourth-quarter revenue up 37% year-over-year to $26.88 billion. What TSMC calls ...