Alchip Technologies has unveiled its advanced 3DIC design services tailored for AI and high-performance computing (HPC) ...

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Proven AI and HPC ASIC Design Flow Production-readyTaipei, Taiwan, Jan. 16, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimen ...

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.

Consumer Electronics Show (CES) 2025 revolved around AI. If not, it’s all that exhibitors could show. Talking about the ...

Global advanced packaging market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-203 1, driven by the rising demand for consumer electronics, the growing demand for high-end ...

North America advanced packaging market is projected to grow by 8.1% annually in the forecast period and reach $8,293.6 million by 2031, driven by the rising demand for consumer electronics, the ...

Following a letter from the company’s co-CEO Jun Young-hyun apologizing for the company’s disappointing preliminary Q3 2024 ...

When chips are made, the transistors are built with built-in strain ... die cracking/delamination increases in these areas,” explained Andras Vass-Varnai, 3D-IC solution engineer at Siemens EDA.

It enhances a chip’s interconnect bandwidth and energy efficiency by ... This integration of optics with silicon—enabled by advancements in chiplet-based technology and 3D-IC packaging—also reduces ...