HPC centers must address the infrastructure bottleneck to integrate quantum systems and unlock their full potential.

Visit BIWIN at Booth #6104 during embedded world NA 2026 to explore eSSDs, embedded memory, and industrial storage built for ...

Read why today’s IC system projects for applications like AI and superscalar acceleration require the most comprehensive HAV ...

Too many wires, too much heat, and too much latency are forcing quantum control electronics deeper into the cold.

Canada's CSC urges the federal government to make chips a formal pillar of its AI strategy to secure sovereign compute.

Nvidia acquires Hugging Face for $12.9 billion, expanding reach across open-source AI models, datasets, and software ...

The CXL-attached memory expansion uses NAND flash optimized for high-speed processing alongside AI compute devices.

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

The EE Times Magazine explores how ambient energy harvesting, sensing, AI, and connectivity enable safer, smarter buildings.

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...