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Ultrathin metal layer boosts spin-related signals, opening a door to ultralow-power electronics
Researchers at Kyushu University have found that an ultrathin layer of iridium manganese (IrMn) can improve two spin-related ...
Power devices continue to evolve rapidly as SiC and GaN technologies become more highly integrated, easy to use, and cost-effective. Meanwhile, steady improvements in MOSFET structures and processes ...
Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen of 2024's most notable ...
Dublin, June 07, 2024 (GLOBE NEWSWIRE) -- The "Global Market for Power Electronics for Electric Vehicles (EVs) 2024-2035" report has been added to ResearchAndMarkets.com's offering. As we pivot ...
Newswise — Texas Tech University’s Edward E. Whitacre Jr. College of Engineering has secured a $6 million U.S. Department of Defense grant to develop advanced semiconductor materials and devices, ...
As the growth in global electricity need and supply continues to accelerate, efficient power electronics will be key to improving grid efficiency, stability, integration, and resilience for all energy ...
Anker offers a huge selection of power banks for anyone on the go that needs to get their devices charged up, but which one ...
This paper investigates the application of time-based fault tolerance techniques in solar photovoltaic (PV), DC–DC converter, battery, and permanent magnet synchronous motor (PMSM) systems. The fault ...
GaN devices are gaining traction due to their ability to tolerate higher voltages. New approaches such as chiplets offer faster switching with less loss. The first applications to benefit from GaN ...
(Nanowerk Spotlight) The interactions between water and surfaces create small electrical charges – a phenomenon that could power the next generation of wearable technology. Small-scale devices that ...
In a paper published as an Editor's Pick in Applied Physics Letters, College of Engineering's Georges Pavlidis outlines ways to manage heat in high-speed electronics UConn’s School of Mechanical, ...
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